• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    In a power converter, external connection lines are output from a semiconductor module and are bent to be separated from a cooling device. Each of the outer wires has a terminal end. The terminal end of each external connection line protrudes from a virtual plane extending along a second surface of a housing. The connection wires each comprise an inner portion disposed in the housing, and an outer portion extending from the housing and folded to be separated from the cooling device. The outer portion of each lead wire has a terminal end. The terminal end of the outer portion of each lead wire protrudes from the virtual plane.
    公开号:FR3045977A1
    申请号:FR1662610
    申请日:2016-12-16
    公开日:2017-06-23
    发明作者:Nobuo Isogai
    申请人:Denso Corp；
    IPC主号:
    专利说明:

    POWER CONVERTER AND ELECTRIC MACHINE
    ROTARY
    TECHNICAL AREA
    The present invention relates to power converters each comprising a housing and at least one semiconductor module installed in the housing, and also relates to rotating electrical machines each comprising at least one of these power converters.
    CONTEXT
    For example, Japanese Patent Publication No. 5774207 discloses a rotating electrical machine equipped with a controller having greater reliability and simpler assembly tasks. The conventional rotating electrical machine disclosed in Patent Publication No. 5774207 comprises a control apparatus which comprises a power module assembly and a control circuit unit. The power module assembly is attached to a housing in which a rotor and a stator are installed, and includes a power converter for performing power conversion between the stator windings and a DC power source disposed at the outside of the rotating electrical machine. The control circuit unit is used to control the power converter. The power module assembly includes a power module comprising switching elements constituting the power converter, and an annular housing incorporating therein the power module. The power module assembly also includes a heat sink that is attached to the housing, and configured to cool the power module. The power module includes a first connection line connected to first electrodes of the switching elements, and a second connecting line connected to second electrodes of the switching elements. The power module also includes a third connection line connected to third electrodes of the switching elements.
    The annular housing includes a first opening and a second opening opposite to each other. The heat sink is inserted into the first opening. The annular housing also includes power connectors, and signal connectors. The power connectors are molded integrally with the housing, and the signal connectors are joined to the third connection lines to be electrically connected thereto.
    ABSTRACT
    Unfortunately, the manufacture of the rotating electrical machine disclosed in Patent Publication No. 5774207 requires the third connection lines to be joined to the signal connectors within the housing. The tools for joining the third connection lines and the signal connectors, such as the tools for soldering the third connection lines and the signal connectors, must be inserted into the housing via the second opening. In order to prevent the insertion of the connection tools from interfering with the periphery of the second opening of the housing, the housing requires that the second opening has a larger area, which results in the increase of the housing size. . This can therefore result in increasing the size of the rotating electrical machine shown in Patent Publication No. 5774207.
    In view of the circumstances set out above, one aspect of the present invention seeks to provide power converters and rotating electrical machines, each of which is designed to solve the problem set forth above.
    Specifically, another aspect of the present invention is to provide these power converters and rotating electrical machines, each of which has a smaller size.
    According to a first exemplary aspect of the present invention, there is provided a power converter for performing the power conversion between an external DC power source and a stator coil of a rotating electrical machine. The power converter comprises a housing having first and second opposed surfaces, and a semiconductor module comprising at least one semiconductor element and having a predetermined surface. The semiconductor module is disposed in the housing to face the first surface of the housing, and is configured to perform the power conversion. The power converter comprises a cooling device arranged to be directly or indirectly in surface contact with the predetermined surface of the semiconductor module. The power converter comprises a plurality of external connection lines emerging from the semiconductor module and folded so as to be separated from the cooling device. Each of the outer wires has a terminal end. The terminal end of each of the external connection lines protrudes from a virtual plane extending along the second surface of the housing. The power converter comprises a plurality of connection wires each having an inner portion disposed in the housing, and an outer portion extending from the housing and folded to be separated from the cooling device. The outer portion of each of the connection wires has a terminal end. The terminal end of the outer portion of each of the connection wires protrudes from the virtual plane. The power converter comprises a junction portion at which the terminal end of each of the outer wires is joined to the terminal end of the outer portion of the corresponding one of the connecting wires. The power converter includes a cover member extending from the second housing surface to the cooling device to cover the external connection lines, the outer portions of the connection wires, and the joint portion. The power converter comprises a resin filler introduced into a space defined between the housing, the cooling device and the covering element.
    In the power converter according to the first exemplary aspect, the terminal end of each of the external connection lines protrudes from the virtual plane extending along the second surface of the housing, and the terminal end of the outer portion each of the connection wires protrudes from the virtual plane. The terminal end of each of the outer wires is joined to the terminal end of the outer portion of the corresponding one of the connecting wires. That is, the connection between the terminal end of each of the outer wires and the terminal end of the outer portion of the corresponding one of the lead wires is located outside the housing. This eliminates the need to ensure an opening having a larger area through the housing, which results in the power converter having a smaller length in the extension direction of each of the external connection lines and each of the connection wires. This allows the power converter to have a smaller size.
    In the power converter according to a second exemplary aspect of the present invention, the semiconductor module comprises a molded housing of a resin wherein said at least one semiconductor element is molded. This contributes to the smaller size of the semiconductor module.
    The semiconductor module of the power converter according to a third exemplary aspect of the present invention comprises a cooled part which is cooled by the cooling device through the predetermined surface of the semiconductor module, and a line of internal connection disposed in the cooled portion and having a greater thickness than each of the external connection lines. This configuration allows the heat generated from said at least one semiconductor element of the semiconductor module to be efficiently transferred to the cooling device via the inner connection line.
    In the power converter according to a fourth exemplary aspect of the present invention, said at least one semiconductor element comprises at least one pair of first and second semiconductor elements connected in series with each other. The first semiconductor element of the at least one pair is an upper branch switching element connected to a positive terminal of the DC power source. The second semiconductor element of the at least one pair is a lower branch switching element connected to a negative terminal of the DC power source. This configuration allows the number of internal connection lines and external connection lines to be reduced, which results in reducing the size of the semiconductor module.
    In the power converter according to a fifth exemplary aspect of the present invention, the semiconductor module has opposite surfaces different from the predetermined surface. The external connection lines comprise a first set of external connection lines emerging from one of the opposite surfaces of the semiconductor module, and a second set of external connection lines exiting from the other opposite surfaces of the semiconductor module. . This configuration allows the first set of external connection lines and the second set of external connection lines, which have a large potential difference, to be separated to the different opposite sides of the semiconductor module. This improves the reliability of the external connection lines of the semiconductor module.
    The power converter according to a sixth exemplary aspect of the present invention further comprises an insulating element interposed between the predetermined surface of the semiconductor module and the cooling device. The insulating element has a greater thermal conductivity than the resin filler. This configuration allows the heat generated from the semiconductor module to be effectively transferred to the cooling device through the insulating adhesive, effectively cooling the semiconductor module.
    In the power converter according to a seventh exemplary aspect of the present invention, the cover element has a first end portion joined to the second surface of the housing, and a second end portion joined to the cooling device. The first end of the cover member has a first assembly portion at one end thereof, and the second housing surface has a second assembly portion formed therein. The first assembly portion of the first end of the cover member is inserted into the second assembly portion of the second surface of the housing.
    This configuration allows the entire space of the cover member to have a labyrinth structure, which more reliably prevents the resin filler introduced into the entire space of the cover member from leaking from from inside the cover element.
    In the power converter according to an eighth exemplary aspect of the present invention, the cover member serves as a portion of the housing for supporting the semiconductor module. This configuration contributes to reducing the size of the power converter.
    According to a ninth exemplary aspect of the present invention, there is provided a rotating electrical machine comprising a rotor, a stator arranged to face the rotor, a frame which rotatably supports the rotor and which supports the stator, and a power converter for performing power conversion between an external DC power source and a stator stator coil. The power converter comprises a housing having first and second opposed surfaces, and a semiconductor module comprising at least one semiconductor element and having a predetermined surface. The semiconductor module is disposed in the housing to face the first surface of the housing, and is configured to perform the power conversion. The power converter comprises a cooling device arranged to be directly or indirectly in surface contact with the predetermined surface of the semiconductor module. The power converter comprises a plurality of external connection lines emerging from the semiconductor module and folded so as to be separated from the cooling device. Each of the outer leads has an end end, and the end end of each of the outer lead lines protrudes from a virtual plane extending along the second surface of the housing. The power converter comprises a plurality of connection wires each having an inner portion disposed in the housing, and an outer portion extending from the housing and folded to be separated from the cooling device. The outer portion of each of the connection wires has a terminal end, and the terminal end of the outer portion of each of the connection wires protrudes from the virtual plane. The power converter comprises a junction portion at which the terminal end of each of the outer wires is joined to the terminal end of the outer portion of the corresponding one of the connecting wires. The power converter includes a cover member extending from the second housing surface to the cooling device to cover the external connection lines, the outer portions of the connection wires, and the joint portion. The power converter comprises a resin filler introduced into a space defined between the housing, the cooling device and the covering element.
    This configuration of the power converter according to the ninth exemplary aspect of the present invention results in the reduction of the size of the power converter, which results in the reduction of the size of the rotating electrical machine.
    In the rotating electrical machine according to a tenth example aspect of the present invention, the frame has an outer side surface on which the housing of the power converter is mounted. This configuration limits the transfer of heat generated from the stator to the cooling device.
    Note that said at least one claimed semiconductor element comprises a switching element, a diode, a transistor, an integrated circuit (IC), and a high integration integrated circuit (LSI). A semiconductor element, which is configured to be closed or open, may constitute the at least one switching element. For example, field effect transistors (FETs), such as metal-oxide-semiconductor field effect transistors (MOSFETs), junction field effect transistors (JFETs), or solid state transistors (FETs), metal-semiconductor field (MSEFET), insulated-line bipolar transistors (IGBTs), gate-off thyristors (GTOs), or power transistors, can be used as switching elements. The claimed power converter can be freely designed as long as the power converter is capable of converting electrical power between the stator coil and the DC power source.
    The claimed semiconductor module may comprise at least one semiconductor element, external connecting lines, inner connecting lines, a housing, and the like. The claimed housing may be made of any material and may be designed to have any shape as long as the semiconductor module, the external connection lines and the inner connecting lines are mechanically associated with the housing. The claimed cooling device may be designed as an air cooling device or a fluid cooling device. The claimed resin filler may be any insulating material. The claimed rotating electrical machine may comprise various machines each comprising a rotatable member, such as a shaft. For example, generators, motors and engine generators may be included in the claimed rotating electrical machine; engines include a motor-generator as a motor, and generators include a motor-generator as a generator.
    BRIEF DESCRIPTION OF THE DRAWINGS Further aspects of the present invention will become apparent from the following description of an embodiment with reference to the accompanying drawings in which: Figure 1 is a partially sectional view schematically illustrating an example of the overall structure of a rotating electrical machine according to the first embodiment of the present invention; Figure 2 is a plan view of the rotating electrical machine illustrated in Figure 1 when viewed in the direction of the arrow II; Fig. 3 is a plan view schematically illustrating an example of the external appearance of a power converter of the rotating electrical machine; Figure 4 is a schematic view schematically illustrating an example of the structure of a housing illustrated in Figure 3; Fig. 5 is a circuit diagram schematically illustrating a first structural example of a semiconductor module shown in Fig. 3; Fig. 6 is a circuit diagram schematically illustrating a second structural example of a semiconductor module shown in Fig. 3; Fig. 7 is a circuit diagram schematically illustrating a third structural example of a semiconductor module shown in Fig. 3; Fig. 8 is a partially sectional view schematically illustrating how the semiconductor module is joined to a cooling device of the power converter; Fig. 9 is a partially sectional view schematically illustrating the situation where an end end of an outer portion of each of the lead wires is in contact with an end end of the corresponding one of the external power connector lead lines; Fig. 10 is a partially sectional view schematically illustrating a joining portion at which the terminal end of the outer portion of each lead wire is joined to the terminal end of the corresponding one of the external connection lines of the power converter; Fig. 11 is a partially sectional view schematically illustrating how a first end portion of a cover member is mounted on the second surface of the housing according to the first embodiment; Fig. 12 is a partially sectional view schematically illustrating a structural example of the power converter; Fig. 13 is a sectional view schematically illustrating a semiconductor module of a power converter according to the second embodiment of the present invention; the semiconductor module comprises a first set of external connection lines exiting from one of the opposite sides of the semiconductor module, and a second set of external connection lines exiting from the other of them; Fig. 14 is a structural example of the power converter according to the second embodiment; Fig. 15 is a modified structural example of the power converter according to the second embodiment; Fig. 16 is a partially sectional view schematically illustrating how the first end portion of the cover member is mounted to the second housing surface according to a modification of the first embodiment; and Fig. 17 is a partially sectional view schematically illustrating how the first end portion of the cover member is mounted on the second housing surface according to another modification of the first embodiment.
    DETAILED DESCRIPTION OF AN EMBODIMENT
    The following describes embodiments of the present invention with reference to the accompanying drawings. Hereinafter, the term "connection" represents an electrical connection, unless additional descriptions are added to the term "connection". Each drawing illustrates main components necessary to describe a portion of the corresponding embodiment assigned for the drawing, and therefore does not necessarily illustrate all the components of the corresponding embodiment part.
    The directions comprising the upper, lower, left and right directions are based on the descriptions in the drawings. Magnetic materials are primarily soft magnetic materials, but can be any material as long as magnetic flux can flow through them. Similarly, the magnetic materials can each have any structure as long as magnetic flux can flow through them. The expression "A is attached to and / or mounted on B" includes at least (1) A is attached to B with bolts or screws (2) A and B are welded to each other
    (3) A is bonded to B (4) A is attached to or mounted on B on the basis of a combination of at least two of the methods (1) to (3) (5) other various expressions similar to these expressions (1 to (4).
    First embodiment
    The following describes a rotating electrical machine 10 according to the first embodiment of the present invention with reference to Figures 1 to 12.
    The rotating electrical machine 10 illustrated in FIG. 1 is designed as a rotating electric machine with an internal rotor. Specifically, the rotating electrical machine 10 comprises a frame 12, a stator 14, a rotor 21, a rotary shaft 24 having first and second axial ends, and cooling fans 13; the stator 14, the rotor 21 and the cooling fans 13 are installed in the frame 12.
    The frame 12 may be of any shape so that the stator 14, the rotor 21 and the cooling fans 13 are installed therein. For example, the frame 12 illustrated in FIG. 1 has a hollow cylindrical shape, and is composed of a hollow cylindrical front frame 12F and a hollow cylindrical rear frame 12R arranged continuously in an axial direction of the frame 12.
    The front frame 12F and the rear frame 12R have central holes aligned coaxially. A portion of the rotary shaft 24 is installed in the frame 12. The first and second axial ends of the rotary shaft 24 are introduced from the central holes of the respective front and rear frames 12F and 12R. Bearings 19 are mounted on the respective central holes of the front and rear frames 12F and 12R, so that the rotary shaft 24 is rotatably supported by the bearings 19.
    The frame 12 has a plurality of cooling air discharge holes 22 and a plurality of cooling air intake holes 23 formed therein. The frame 12 serves both as support and housing. Electronic components, such as coils, capacitors, or sensors, particularly an angle of rotation sensor, which are difficult to install in at least one power converter 20 described later, can be installed in the frame 12. .
    The frame 12 supports the stator 2 therein. The stator 2, which serves as the armature of the rotating electrical machine 10, comprises a stator core 14b and a stator coil 14a. The stator core 14b has, for example, a substantially annular shape, and is disposed in the frame 12 so as to be coaxial with the frame 12 and the rotary shaft 24. The stator core 14b is, for example, configured as a stack of steel sheets composed of a plurality of magnetic steel sheets stacked one on top of the other. This stack configuration of the stator core 14b is intended to limit the occurrence of eddy currents to reduce loss in the iron. The stator core 14b also includes, for example, a plurality of slots formed therethrough. The slots are formed through the stator core 14b in its axial direction and are arranged circumferentially at given intervals.
    The stator coil 14a is composed of three or more phase windings wound through the slots of the stator core 14b.
    The rotor 21 comprises a pair of rotor cores 21a and 21c, and a rotor coil 21b. For example, each of the rotor cores 21a and 21c is made of a magnetic material, and has a predetermined configuration. For example, the rotor cores 21a and 21c are arranged in the stator 14 so as to face each other in the axial direction of the stator 14, and are directly or indirectly mounted on the rotary shaft 34 in the rotor 21.
    Like the stator core 14b, each of the rotor cores 21a and 21c is, for example, configured as a stack of steel sheets composed of a plurality of magnetic steel sheets stacked one on top of the other.
    For example, each of the rotor cores 21a and 21c comprises a circular base; the circular base may comprise an annular base, a circular plate type base, or a hollow cylindrical shape. The circular base of the rotor core 21a and the circular base of the rotor core 21c are arranged to face each other. Each of the rotor cores 21a and 21c has a plurality of claw poles extending from the outer periphery of the axial end of the corresponding base from the circular bases to the other thereof with predetermined pitch in the direction circumferentially of the corresponding base among the circular bases. Note that the circumferential and radial directions of the rotating electrical machine 10 are perpendicular to each other as shown in Figures 1 and 2.
    Each of the claw poles of each of the rotor cores 21a and 21c has a predetermined width and a predetermined thickness; the width of each claw pole of each of the rotor cores 21a and 21c decreases towards the other of the rotor cores 21a and 21c. That is, each of the plurality of claw poles extends from the outer periphery of the corresponding base from the circular bases to the other thereof so as to have a substantially shaped cross-sectional area. L perpendicular to the direction of its width. Each of the plurality of claw poles may have another cross-sectional shape, such as a J-shape or a U-shape.
    The claw poles of one of the rotor cores 21a and 21c and the claw poles of the other of the rotor cores 21a and 21c are arranged alternately in the circumferential direction of the rotor cores 21a and 21c so that they engage in each other like fingers. As described above, each of the rotor cores 21a and 21c having the claw poles is made of at least one magnetic material.
    The rotor coil 21b, which serves as an inductor winding, is disposed coaxially between the rotor cores 21a and 21b so that the claw poles wind around the rotor coil 21b. When the rotor coil 21b is energized, the claw poles of the rotor core 21a are magnetized to have one of the N and S poles, and the claw poles of the rotor core 21c are magnetized to have the other of the poles. N and S. This results in that the N and S poles are arranged alternately in the circumferential direction of the rotor 21.
    The rotor 21 is disposed coaxially inside the stator 14 with a predetermined radial gap (spacing) with respect to the stator 14. The radial length of the air gap between the rotor 21 and the stator 14 can be freely fixed as long as the rotor 21 and the stator 14 can not come into contact with each other, and a magnetic flux can flow between the stator 14 and the rotor 21.
    Each of the cooling fans 13 serves as a cooling device. The cooling fans 13 are mounted on the respective axial end surfaces of the rotor 21 so as to be close to the stator coil 14a. When the cooling fans 36 are rotated with the rotor 21, each cooling fan 36 acts to draw cooling air from the outside of the frame 12 through the cooling air intake holes 23 supplying the cooling air to the interior of the frame 12, and discharging the cooling air delivered from the frame 12 through the cooling air discharge holes 22. This cools the entire rotating electrical machine 10 comprising a brush holder 16 described later, and the stator 14.
    As described above, the rotary shaft 24 is rotated with the rotor 21, because the rotor 21 is directly or indirectly mounted on the rotary shaft 24.
    The rotary electrical machine 10 comprises a pulley 11, a brush holder 16 comprising brushes 17, slip rings 18, and at least one power converter 20.
    The pulley 11 is mounted on the first end of the rotary shaft 24, which protrudes from the central hole of the front frame 12F with fastening elements 25. The slip rings 18, which each have an electrically conductive characteristic, are mounted coaxially on the second end of the rotary shaft 24. The two ends of a non-illustrated transfer belt are respectively wound on the pulley 11 and a rotating shaft of a power source, such as an internal combustion engine when the machine rotating electric motor 10 is installed in a vehicle. This allows the rotational power to be transferred between the rotating electrical machine 10 and the internal combustion engine via the transfer belt.
    The slip rings 18 are connected to the rotor coil 21b by means of conducting wires. The slip rings 18 are brought into contact with the brushes, such as positive and negative brushes, 17 installed in the brush holder 16, and the brushes 17 are connected to the regulator 15 via the terminals of the brush holder 16. The brush holder 16 has an isolation performance.
    The brush holder 16 has a through hole through which the second end of the rotary shaft 24 passes while the slip rings 18 are arranged in the brush holder 16. The brushes 17 installed in the brush holder 16 are pressed for come into contact with the respective slip rings 18.
    The regulator 15, the brush holder 16 comprising the brushes 17, and the slip rings 18 are arranged around the second end of the rotary shaft 24 so as to face an outer end surface, that is to say ie, an outer surface, SO of the rear frame 12R in the axial direction of the frame 12. As described later, said at least one power converter 20 is mounted on the outer end surface SO of the rear frame 12R. These regulator 15, brush holder 16, slip rings 18 and said at least one power converter 20 are, for example, covered by a rear cover RC.
    The regulator 15 is connected to an external device 30, and is used to adjust an inductor current to be supplied to the rotor coil 21b on the basis of information sent from the external device 30. The regulator 15 may comprise connectors which allow that the external device 30 is connected to the control terminals of the switching elements, which are described later, of said at least one power converter 20. This allows the external device 30 to control the switching elements of the power converter assembly 30, allowing the external device 30 to control the manner in which the rotating electrical machine 10 is rotated or in operation. The regulator 15 may be connected to said at least one power converter 20 or may not be connected thereto.
    The external device 30 is configured to control the regulator 15 to control the inductor current supplied to the rotor coil 21b accordingly, and to control the at least one power converter 20 to control an alternating current supplied to the stator coil 14a. This configuration controls the manner in which the rotating electrical machine 10 is rotated. This configuration also causes the stator coil 14a to generate alternating power (AC), and causes the at least one power converter 20 to convert the AC power into DC power, thereby charging a DC power source (DC) E, which is connected to said at least one power converter 20, based on the continuous power. The external device 30 includes a processor-based controller, such as a microcomputer or an electronic control unit (ECU). The external device 30 may be arranged outside the rotating electrical machine 10 as illustrated in FIG. 1, or it may be placed inside the rotating electrical machine 10 in the same manner as the at least one power converter. As shown in FIG. 2.
    The continuous power source E comprises at least one battery, such as a fuel cell, a solar battery, a lithium battery, or a lead-acid battery. Fuel cells and solar batteries are main batteries capable of delivering continuous power. Lithium batteries and lead-acid batteries are secondary batteries, ie rechargeable continuous-power batteries. In particular, secondary batteries, such as lithium batteries or lead-acid batteries, are preferably used as a continuous power source E, because the rotary electrical machine 10 is capable of operating in a power operating mode. and in a regeneration mode. The rotating electrical machine 10 operating in the power operating mode operates on the basis of the power supplied, and the rotating electrical machine 10 operating in the regeneration mode generates power when it is decelerated.
    As illustrated in FIG. 2, said at least one power converter 20 is mounted on the outer end surface SO of the rear frame 12R. Said at least one power converter 20 is used to effect the power conversion between the DC power source E and at least one of the stator coil 14a and the rotor coil 21b of the rotating electrical machine 10. Specifically when the rotating electrical machine 10 is operating in the power operating mode, the continuous power source E supplies the electrical power to the coils of the rotating electrical machine 10 via said at least one power converter 20. In addition, when the rotating electrical machine 10 is operating in the regeneration mode, the continuous power source E is charged on the basis of the electric power supplied from the stator coil 14a via said at least one power converter 20.
    As illustrated in FIG. 2, said at least one power converter 20 according to the first embodiment is composed of three power converters, which are called power converters 20A, 20B and 20C, mounted on the outer end surface SO of the rear frame 12R so as to surround the brush holder 16. The power converters 20A, 20B and 20C are communicatively connected to each other. The power converters 20A, 20B and 20C have a substantially identical shape, except for a terminal portion 201 of the power converter 20A. The following therefore describes in detail the structure of the power converter 20A as a representative converter of the power converters 20A, 20B and 20C.
    Figure 3 schematically illustrates the external appearance of the power converter 20A.
    The power converter 20A illustrated in FIG. 3 comprises, for example, a housing 204, terminal parts 201 and 205, a cooling device 202, and a semiconductor module 203. For example, the housing 204 has a shape rectangular or square. For example, the terminal portion 201 extends to extend, for example, from one side of the housing 204. The terminal portion 201 serves as an output terminal for connection to a vehicle wiring. . That is, the terminal portion 201 is connected to the semiconductor module 203, and also connected to the DC power source E via the vehicle wiring. This allows an electrical connection to be established between the semiconductor module 203 and the DC power source E. The terminal portion 205 also serves as an output terminal connected to the other power converters 20B and 20C. That is, the terminal portion 205 of the power converter 20A is connected to the semiconductor module 203, and also connected to the terminal portions 205 of the other power converters 20B and 20C. This allows an electrical connection to be established between the semiconductor module 203 of the power converter 20A and the semiconductor modules 203 of the other power converters 20B and 20C.
    The semiconductor module 203 comprises one or more semiconductor elements, such as switching elements and / or diodes, and a substantially cuboid molded housing 203a (see Figures 8 to 12 described later) having first and second surfaces. S2a and S2b opposite. That is, said one or more semiconductor elements are molded to be packaged. The semiconductor module 203 is supported by the housing 204.
    The cooling device 202 comprises, for example, a substantially cuboidal body 202b having opposite first and second surfaces S3a and S3b, and a plurality of fins 202a protruding vertically from the first surface S3a of the body 202b. The cooling device 202 is mounted, at its second surface S3b, on the first surface S2a of the semiconductor module 203 (molded housing 203a) via an insulating adhesive 206 (see, for example, FIGS. 8 and 9).
    As illustrated schematically in FIG. 4, the housing 204 comprises, for example, a substantially cuboidal body 204d, which is made of, for example, a resin and has first and second opposing surfaces Sla and Slb. The housing 204 includes a plurality of connection wires 204a, at least a terminal portion 204b, and a plurality of side walls 204c. The body 204d has a predetermined length, a predetermined width, and a predetermined thickness; the length of the body 204d in the first and second longitudinal directions XI and X2 of the body 204d is greater than the width of the body 204d in the first and second width directions Y1 and Y2 of the body 204d. Note that both the first and second longitudinal directions XI and X2 and the first and second width directions Y1 and Y2 are along the outer end surface SO of the rear frame 12R shown in Figure 2.
    Each of the connection wires 204a comprises an inner portion integrated into the body 204d of the housing 204, and an outer portion issuing from a Sic side of the body 204d in a first lateral direction ZI of the first and second lateral directions ZI and Z2, and folded perpendicularly so as to extend in the first direction of width Y1 (see Figure 9). Note that in each of Figures 8 to 12, the first and second lateral directions ZI and Z2 of the body 204d, which intersect the first and second directions of width Y1 and Y2 and the first and second longitudinal directions XI and X2, are defined.
    Said at least one terminal portion 204b is connected to the inner portions of the connecting wires 204a, and protrudes outside the body 204d in the first width direction Y1. As illustrated in FIG. 4, the projection length of said at least one terminal portion 204b in the first and second width directions Y1 and Y2 may be greater or smaller than the projection length of the outer portion of each wire. connection 204a in the first and second directions of width Y1 and Y2.
    The plurality of sidewalls 204c extend in the second side of the first and second width directions Y1 and Y2, and are arranged to face each other with a predetermined space therebetween in the first and second longitudinal directions XI and X2. The semiconductor module 203 is mounted on the first surface Sla of the body 204d between the side walls 204c in the first and second longitudinal directions XI and X2 (see the dotted line in Figure 4). Although removed in FIG. 4, the cooling device 202 is mounted on or over the semiconductor module 203 and the side walls 204c in the first and second width directions Y1 and Y2.
    The following describes examples of the circuit included in the semiconductor module 203 with reference to FIGS. 5 to 7.
    The semiconductor module 203 is composed of at least one of a semiconductor module Ml illustrated in FIG. 5, a semiconductor module M2 illustrated in FIG. 6, and a semiconductor module. M3 driver shown in Figure 7.
    Note that, although eliminated in each of FIGS. 5 to 7, the semiconductor module 203 comprises internal connection lines 203c and external connection lines 203d, which are illustrated in FIGS. 8 to 12, in addition to the module corresponding among the semiconductor modules Ml, M2 and M3. Each of the inner connecting lines 203c and external connecting lines 203d has, for example, a platelet form. It can be determined freely how each of the semiconductor modules Ml, M2 and M3 is implemented. For example, semiconductor elements may be mounted on a circuit board, and connected to each other by wires to implement each of the semiconductor modules M1, M2 and M3. A semiconductor chip can implement each of the semiconductor modules M1, M2 and M3.
    The semiconductor module M1 illustrated in FIG. 5 comprises switching elements Q1 and Q2, which are each composed of an insulated line bipolar transistor (IGBT), and protection diodes DI and D2. The protection diode DI is connected in parallel with the switching element Q1 so that the cathode of the protective diode DI is connected to the collector of the switching element Q1. The protective diode D2 is connected in parallel with the switching element Q2 so that the cathode of the protective diode D2 is connected to the collector of the switching element Q2. The switching elements Q1 and Q2 are connected in series with each other. The assembly of the switching element Q1 and the protective diode DI is connected to the positive terminal of the continuous power source E, thus constituting an upper branch element. The assembly of the switching element Q2 and the protection diode D2 is connected to the negative terminal of the continuous power source E, thus constituting a lower branch element.
    The semiconductor module Ml comprises a connection terminal Pd connected to the input terminal, that is to say to the collector, of the switching element Q1, and a connection terminal Pgl connected to the control terminal i.e., at the line, of the switching element Q1.
    The semiconductor module Ml also comprises a connection terminal Ps connected to the output terminal, that is to the transmitter, of the switching element Q2, and a connection terminal Pg2 connected to the terminal control, that is to say, the line, the switching element Q2.
    The output terminal, i.e. the transmitter, of the switching element Q1 and the input terminal, i.e. the collector, of the switching element Q2 are connected to each other. one to the other at the point of connection PI. The semiconductor module Ml comprises a connection terminal Pmi connected to the connection point PI of the switching elements Q1 and Q2.
    The connection terminals Pd, Pgl, Pg2, Ps and Pmi are connected to the inner connection lines 203c, or extend outside the molded case 203a of the semiconductor module 203 as some of the external connection lines 203d.
    The semiconductor module M2 illustrated in FIG. 6 comprises switching elements Q11 and Q12, which are each composed of a metal-oxide-semiconductor field effect transistor (MOSFET). Because each of the Q11 and Q12 (MOSFET) switching elements intrinsically comprises an intrinsic diode, the intrinsic diodes of the switching elements Q11 and Q12 serve as protection diodes, thus eliminating additional protective diodes such as DI diodes and D2.
    The switching elements Q11 and Q12 are connected in series with each other. The switching element Q11 is connected to the positive terminal of the continuous power source E, thus constituting an upper branch element. The switching element Q12 is connected to the negative terminal of the continuous power source E, thus constituting a lower branch element.
    The semiconductor module M2 comprises a connection terminal Pd connected to the input terminal, that is to say to the drain, of the switching element Q11, and a connection terminal Pgl connected to the control terminal , i.e., at the line, of the switching element Q11.
    The semiconductor module M2 also comprises a connection terminal Pgl connected to the output terminal, that is to the source, of the switching element Q12, and a connection terminal Pg2 connected to the terminal of control, that is to say at the line, of the switching element Q12.
    The output terminal, i.e. the source, of the switching element Q11 and the input terminal, i.e. the drain, of the switching element Q12 are connected to one another. one to the other at the point of connection P2. The semiconductor module M2 comprises a connection terminal Pm2 connected to the connection point P2 of the switching elements Q11 and Q12.
    The connection terminals Pd, Pgl, Pg2, Ps and Pm2 are connected to the inner connecting lines 203c, or extend outside the semiconductor module 203 as some of the external connecting lines 203d.
    Instead of the IGBTs of the semiconductor module Ml and / or the MOSFETs of the semiconductor module M2, junction-effect field effect transistors (JFETs), metal-semiconductor field effect transistors (MSEFETs), Trigger-off thyristors (GTO), or power transistors may be used.
    The semiconductor module M3 illustrated in FIG. 7 comprises diodes D11 and D12. The semiconductor module M3 differs from the semiconductor module M1 in that no switching element Q1 and Q2 is provided. Diodes DI 1 and D12 are connected in series with each other.
    The semiconductor module M3 comprises a connection terminal Pk connected to the cathode of the diode D11, and a connection terminal Pa connected to the anode of the diode D12. The anode of the diode D11 and the cathode of the diode D12 are connected to each other at the point of connection P3. The semiconductor module M3 comprises a connection terminal Pm3 connected to the connection point P3 of the diodes D11 and D12.
    The connection terminals Pk, Pa and Pm3 are connected to the inner connection lines 203c, or extend outside of the semiconductor module 203 as some of the external connection lines 203d.
    The following describes an example of the detailed structure of the semiconductor device 20 with reference to FIGS. 8 to 12. FIGS. 8 to 12 eliminate the illustration of the switching elements and / or diodes included in the semiconductor module 203. .
    For example, Figs. 8 to 12 illustrate (1) How the semiconductor module 203 is joined to the cooling device 202 (2) How a terminal end of each of the connection wires 204a is in contact with a terminal end of the line corresponding one of the external connecting lines 203a (3) How the terminal end of each of the connecting wires 204a is joined to the terminal end of the corresponding one of the external connecting lines 203a (4) How a covering element described subsequently is mounted on the semiconductor device 20.
    As described above, the insulating adhesive 206 is interposed between the first surface S2a of the semiconductor module 203 and the second surface S3b of the cooling device 202 for the surface contact between the semiconductor module 203 and the cooling device. 202. The insulating adhesive 206 has a higher thermal conductivity than a resin filler 209 described later and illustrated in FIG. 12.
    The semiconductor module 203 comprises a cooled portion 203b that is indirectly in surface contact with the cooling device 202, so that the cooled portion 203b is cooled by the cooling device 202 through the first surface S2a. The inner connecting lines 203c, which are enclosed in the semiconductor module 203, are preferably disposed in the cooled portion 203b. Each of the inner connecting lines 203c has a greater thickness than the external connecting lines 203d.
    At least a portion of the inner connecting lines 203c may be exposed from the molded housing 203a to improve the cooling efficiency of the inner connecting lines 203c.
    Each of the external connecting lines 203d, for example, emerges from a side S2c of the molded housing 203a in the first lateral direction ZI; the side S2c corresponds to the Sic side of the body 204d. Each of the external connecting lines 203d is folded to be separated from the cooling device 202 in the first width direction Y1.
    The outer portion of each of the connection wires 204a has the terminal end T1, and each of the external connection lines 203d has the terminal end T2. As shown in FIG. 9, the terminal end T1 of the outer portion of each of the connection wires 204a is in contact with the terminal end T2 of the corresponding one of the external connection lines 203d. That is, the outer portion of each connecting wire 204a exits the Sic side of the body 204d in the first lateral direction Z1, and is folded perpendicularly so as to extend in the first width direction Y1 so as to to be separated from the cooling device (see the left side of Figure 9). Similarly, each external connection line 203d leaves the S2c side of the molded housing 203a in the first lateral direction Z1, and is folded so as to be separated from the cooling device 202 in the first width direction Y1.
    This allows the terminal end T1 of the outer portion of each of the connection wires 204a to contact the terminal end T2 of the corresponding one of the external connection lines 203d.
    As illustrated in FIG. 10, the terminal end T1 of the outer portion of each of the connection wires 204a is electrically connected to the terminal end T2 of the corresponding one of the external connection lines 203d. Reference numeral 207 represents the joining portion between the terminal end T1 of the outer portion of each of the connecting wires 204a and the terminal end T2 of the corresponding one of the external connecting lines 203d. For example, the terminal end T1 of the outer portion of each of the connection wires 204a is welded or soldered to the terminal end T2 of the corresponding one of the external connecting lines 203d. The terminal end T1 of the outer portion of each of the connection wires 204a and the terminal end T2 of each of the external connection lines 203d are located outside the housing 204. This allows the joining task between the terminal end T1 of the outer portion of each of the connection wires 204a and the terminal end T2 of the corresponding one of the external connecting lines 203d is easily performed.
    As illustrated in FIG. 10, the terminal end T1 of the outer portion of each of the connection wires 204a and the terminal end T2 of each of the external connection lines 203d may be located so as to be close to the second surface Slb of the body 204d.
    Referring to Fig. 11, the power converter 20 includes a cover member, i.e., a cover member 208, which extends from the first end of the body 204d into the first lateral direction Z1 until at the second surface Slb of the body 204d so as to cover the connection wires 204a and the external connection lines 203d, thus covering, that is to say protecting, the connection wires 204a, the external connection lines 203d and 207. This results in that a first space SP1 is mainly formed between the covering element 208, the housing 204 and the cooling device 202, and that a second space SP2 communicates with the first space SP1. space SP1, is mainly formed between the cooling device 202, the semiconductor module 203 and the housing 204.
    For example, the cover member 208 includes a body 208c having a substantially J-shaped cross section in the first and second width directions Y1 and Y2. The body 208c has a first end portion 208b joined, for example, to the second surface Slb of a first end of the body 204d of the housing 204 in the direction Z1. The first end portion 208b of the body 208c has, at its tip, a first assembly portion 208a joined to a second assembly portion 204e formed in the second surface Slb of the first end of the body 204d in the direction Zl.
    For example, the first assembly part 208a has a convex shape, and the second assembly part 204e has a concave shape in accordance with the convex shape, so that the first assembly part 208a is easily inserted into the second assembly part 204e. The cover member 208 may be made of a resin.
    The body 208c also has a second end portion 208d, opposite the first end portion 207b. The surface of the second end 108d of the body 208c is joined, for example, to the second surface S3b of a first end of the body 202b of the cooling device 202 in the direction Z1. The surface of the second end 108d of the body 208c is preferably joined to the corresponding end of the second surface S3b of the body 202b of the cooling device 202 by an adhesive (not shown). This prevents a subsequently described resin filler 209 from leaking from within the cover member 208. The same material as that of the adhesive 206 shown above can be used.
    As the material of the adhesive used to join the cover member 208 and the cooling device 202, the same material as that of the adhesive 206 or other material may be used.
    As illustrated in FIG. 11, the joining portion 207 between the terminal end T1 of the outer portion of each of the connection wires 204a and the terminal end T2 of the corresponding line of the external connection lines 203d is located protruding from a virtual plane VP extending along the second surface Slb in the first lateral direction Z1. For this reason, the body 208c of the cover member 208 has a height H1 projecting from the virtual plane VP in the first lateral direction Z1 greater than the height of the joining portion 207 projecting from the virtual plane VP in the Zl direction (see Figure 11). The height H1 of the body 208c of the cover member 208 relative to the virtual plane VP is preferably set smaller than the height H2 of said at least one terminal portion 204b with respect to the second surface Slb in the first lateral direction Z1. This configuration prevents the cover member 208 from projecting outwardly from said at least one terminal portion 204b in the first lateral direction Z1, thereby maintaining the size of the compact power converter.
    With reference to FIG. 12, the power converter 20 comprises a resin filler 209 introduced into the first and second spaces SP1 and SP2 of the power converter 1. The resin filler 209 prevents the entry of water and / or dust particles within the housing 204. The resin filler 209 also dissipates heat, which is generated from the semiconductor module 203, through the cooling device 202, the housing 204 and the cover member 208. For example, the resin filler 209, which has insulation performance, is inserted into the first and second spaces SP1 and SP2 through an opening OP ; the opening OP is defined between a second end of the body 202b of the cooling device 202 in the direction Z2 and a second end of the body 202b of the cooling device 202 in the direction Z2. The second end of the body 202b of the cooling device 202 in the direction Z2 is opposite the first end of the body 202b in the direction Z1, and the second end of the body 202b of the cooling device 202 in the direction Z2 is at the opposite of the first end of the body 202b of the cooling device 202 in the direction Zl. The resin filler 209 may be made of a resinous material which cures after being introduced into the first and second spaces SP1 and SP2, or of a resinous material which becomes viscous after being introduced into the first and second spaces SP1 and SP2.
    As described above, the first embodiment provides the following advantageous effects.
    The power converter 20, as illustrated in FIGS. 3 to 12, comprises the cooling device 202, the external connection lines 203d, the connection wires 204a, the connecting part 207, the covering element 208 and the resin filler 209.
    The cooling device 202 is indirectly brought into contact, at the second surface S3b, with the first surface S2a of the semiconductor module 203 to cool the semiconductor module 203. Each of the external connection lines 203d leaves the molded housing 203a of the semiconductor device 203, and is folded to be separated from the cooling device 202. Each of the connection wires 204a comprises the inner portion disposed in the body 204d of the housing 204, and the outboard portion of the body 204d and folded perpendicularly in the same direction as external connecting lines 203d.
    The joining portion 207 at which the terminal end T1 of the outer portion of each of the connecting wires 204a is electrically connected to the terminal end T2 of the corresponding one of the external connecting lines 203d. The cover member 208 is configured to extend from the first end of the body 204d in the first lateral direction ZI to the second surface Slb of the body 204d so as to cover the connection wires 204a and the external connection lines. 203d, thus covering the connecting wires 204a, the outer connecting lines 203d and their joining portions 207. The resin filling agent 209 is introduced into both the first space SP1 mainly formed between the cover member 208 and the terminal ends T1 and T2 and in the second space SP2 mainly formed between the cover member 208, the cooling device 202, the semiconductor module 203 and the housing 204.
    In particular, the terminal end T1 of the outer portion of each of the connection wires 204a and the terminal end T2 of the corresponding one of the external connecting lines 203d extend so as to project from the vertical plane VP along the second surface Slb of the housing 204; the second surface Slb is opposite to the first surface S2a of the semiconductor package 203. This eliminates the need to ensure that the aperture has a larger area through the housing 204, which results in the converter The power supply 20 has a smaller length in the extension direction of each of the external connection lines 203d and the connection wires 204a in the first width direction Y1. This allows the power converter 20 to have a smaller size.
    In addition, as illustrated in FIGS. 5 to 12, the semiconductor module 203 comprises one or more semiconductor elements (see FIGS. 5 to 7), and the substantially cuboid molded housing 203a in which the one or more semi elements. -conductors are molded so as to be packaged. This contributes to the smaller size of the semiconductor module 203.
    With reference to FIG. 8, the semiconductor module 203 comprises the inner connecting lines 203c disposed in the cooled portion 203b; the cooled portion 203b comprises the first surface S2a and is cooled by the cooling device 202. Each of the inner connecting lines 203c has a greater thickness than the external connecting lines 203d. This configuration allows the heat generated from the semiconductor elements, particularly the switching elements, such as the switching elements Q1, Q2, Q11 or Q12 of the semiconductor module 203, to be efficiently transferred to the cooling device 202 via the intermediate circuit. internal connecting lines 203c.
    With reference to FIGS. 5 to 7, the semiconductor module 203 comprises at least one pair of the upper branch semiconductor element, such as the switching element Q1, the switching element Q11, or the diode DU. and the lower leg semiconductor element, such as the switching element Q2, the switching element Q12, or the diode D12, connected in series with the upper branch switching element. This configuration makes it possible to reduce the number of the internal connection lines 203c and the external connection lines 203a, which results in a reduction in the size of the semiconductor module 203.
    As illustrated in FIGS. 8 to 12, the power converter 20 comprises the insulating adhesive 206 interposed between the first surface S2a of the semiconductor module 203 and the second surface S3b of the cooling device 202; the insulating adhesive 206 has a greater thermal conductivity than the resin filler 209. This configuration allows the heat generated from the semiconductor module 203 to be efficiently transferred to the cooling device 202 via the insulating adhesive 206, thereby effectively cooling the semiconductor module 203. The covering member 208 comprises the body 208c, and the body 208c has the first end portion 208b joined to the second surface 1b of the first end of the second surface Slb of the body 204d of the housing 204 in the direction Z1. The first end portion 208b of the body 208c has, at its end, the first assembly portion 208a joined to the second assembly portion 204e formed in the second surface Slb of the first end of the body 204d in the direction Zl. This configuration allows the entire space of the cover member 208 to have a labyrinth structure, which more reliably prevents the resin filler 209 introduced into the entire space of the cover member 208 from leaking from within the cover member 208.
    Like the side walls 204c shown in Fig. 4, the cover member 208 is configured to serve as a portion of the housing 204 for supporting the semiconductor module 203 as shown in Fig. 12. This configuration contributes to the reduction of the size of the power converter 20.
    With reference to FIG. 1, the rotating electrical machine 10 comprises the rotor 21, the stator 14 arranged so as to face the rotor 21, the frame 12 which rotatably supports the rotor 21 and which supports the stator 14, and the converter The power converter 20 having a smaller size allows the rotating electrical machine 10 to have a smaller size.
    As illustrated in FIG. 2, the housing 204 of the power converter 20 is mounted on the outer end surface SO of the frame 12. This configuration limits the transfer of the heat generated from the stator 14 to the cooling device 202.
    Second embodiment
    The following describes a power converter 20A of a rotating electrical machine according to the second embodiment of the present invention with reference to FIGS. 13 to 15. The structures and / or functions of the power converter 20A and the rotary electric machine according to the second embodiment differ from those of the power converter 20 and the rotary electrical machine 10 according to the first embodiment as to the following points. Also, the following mainly describes the different points, and omits or simplifies descriptions of similar parts between the first and second embodiments, to which identical or similar reference characters are assigned, thereby eliminating redundant descriptions.
    The power converter 20A comprises a semiconductor module 203A. The semiconductor module 203A comprises, in addition to the structure of the semiconductor module 203, external connecting lines 203d1 emerging from one side S2d of the molded housing 203a, which is opposite the side S2c, in the first lateral direction Zl. Each of the external connecting lines 203d1 is folded to be separated from the cooling device 202 in the first width direction Y1.
    For example, external connection lines 203d1, which are located on the upper side of Fig. 14, are used for higher voltage transfer, such as transfer of several hundred volts. The external connection lines 203d, which are located on the underside of Figure 14, are used for a lower voltage transfer, such as a voltage transfer from several volts to several dozen volts. This configuration allows the potential differences between the external connection lines 203d and the potential differences between the external connection lines 203d1 to be reduced, thus avoiding the occurrence of short circuits among the external connection lines 203d and among the lines external connection 203d 1.
    The power converter 20A using the semiconductor module 203A is configured as shown in Fig. 14. The external connection lines 203d1 serve as some of the connection terminals of the semiconductor module 203A.
    As illustrated in FIG. 14, the power converter 20A comprises a specific connection structure on the side of the first lateral direction Z1. Specifically, the external connecting lines 203d exit from the side S2c of the molded housing 203a in the first lateral direction Z1, and the outer portion of each connecting wire 204a leaves the Sic side of the body 204d in the first lateral direction Z1. The terminal end T1 of the outer portion of each of the connecting wires 204a is electrically connected to the terminal end T2 of the corresponding one of the external connecting lines 203d, so that the joining portion 207 is formed. The cover member 208 is configured to extend from the first end of the body 204d in the first lateral direction ZI to the second surface Slb of the body 204d so as to cover the connection wires 204a and the external connection lines. 203d, thus covering the connecting wires 204a, the external connecting lines 203d and their joining portions 207.
    As a modification of the power converter 20A, a power converter 20B comprises a second specific connection structure on the side of the second lateral direction Z2, which is substantially identical to the specific connection structure on the side of the second lateral direction Z2 ( see Figure 15).
    Specifically, external connecting lines 203d1 exit from side S2d of molded housing 203a in the second lateral direction Z2, and the outer portion of each connecting wire 204a1 leaves Sld side, which is opposite the Sic side, of the body 204d in the second lateral direction Z2. The terminal end T1 of the outer portion of each of the connection wires 204a1 is electrically connected to the terminal end T2 of the corresponding one of the external connecting lines 203d1, so that a joining portion 207A is formed. A cover member 208A is configured to extend from the second end of the body 204d in the second lateral direction Z2 to the second surface Slb of the body 204d so as to cover the connection wires 204a1 and the external connection lines 203d1. , thus covering the connection wires 204al, the external connection lines 203d1 and their connecting portions 207a. The resin filler 209 is therefore introduced into the cover member 208A.
    The semiconductor module 203A is fully installed in the housing 204 and the resin filler 209, which prevents the semiconductor module 203A from being exposed. The cover member 208A has at least one through hole 208e formed therethrough; said at least one through hole 208e is used to introduce the resin filler 209 into the first and second spaces SP1 and SP2. An additional resin filler may be introduced into the at least one through-hole 208e after the resin filler 209 has been fully introduced into each of the cover members 208 and 208A, or a non-illustrated stop member may be introduced into said at least one through hole 208e after the resin filler 209 has been completely introduced into each of the cover members 208 and 208A.
    As described above, the power converter 20A or 20B according to the second embodiment is configured so that the external connecting lines 203d and the external connecting lines 203d1 exit respective sides S2c and S2d of the molded housing 203a, which are the opposite of each other. The power converter 20A or 20B according to the second embodiment may be configured so that the external connecting lines 203d and the external connecting lines 203d1 exit from different sides of the molded case 203a. These configurations allow the external connecting lines 203d and the external connecting lines 203d1, which have a large potential difference, to be separated to different sides of the molded case 203a. This improves the reliability of the external connection lines 203d and 203d 1 of the semiconductor module 203A.
    The first and second embodiments of the present invention have been described, but the present invention is not limited to them. In other words, various modifications may be made within the scope of the present invention.
    As illustrated in FIGS. 11 and 15, each of the first and second embodiments is configured such that the first assembly portion 208a has a convex shape, and the second assembly portion 204e has a concave shape in accordance with the convex shape, so that the first assembly portion 208a is easily inserted into the second assembly portion 204e. However, the present invention is not limited to this configuration.
    Specifically, the first assembly portion 208a may have a concave shape, and the second assembly portion 204e may have a convex shape in accordance with the concave shape. This also allows the first assembly portion 208a to be easily inserted into the second assembly portion 204e.
    In addition, as illustrated in FIG. 16, the first assembly portion 208a may have a concave shape, and the second assembly portion 204e may have an identical concave shape. In this modification, a bar-type or plate-like junction element 210 is prepared, each end thereof being in conformity with the concave shape. One end of the joint member 210 is inserted into the first joint portion 208a, and the other end of the joint member 210 is inserted into the second joint portion 204e, thereby securely joining the first portion of the joint portion 210a. end 208b of the body 208c to the second surface Slb of the first end of the second surface Slb of the body 204d.
    In addition, as illustrated in FIG. 17, the first assembly portion 208a may have a convex shape, and the second assembly portion 204e may have an identical convex shape. In this modification, a tubular connecting member 211 is prepared; the inner cylindrical space of the tubular connecting element 211 is in conformity with the first convex-shaped connecting portion 208a and the second convex-shaped assembling portion 204e. One of the first convex shaped portion 208a and the second convexly shaped second portion 204e is inserted into the inner cylindrical space of the tubular joint member 211 from an axial side, the other one of the first convexly shaped connecting portion 208a and the second convexly conveying second portion 204e is inserted into the inner cylindrical space of the tubular connecting member 211 from the other axial side , thus firmly joining the first end portion 208b of the body 208c to the second surface Slb of the first end of the second surface Slb of the body 204d.
    These modifications illustrated in FIGS. 16 and 17 provide the same advantageous effects to the same advantageous effects provided by the first embodiment or the second embodiment, because the above differences between these modifications and each embodiment are in the first embodiment. scope of the present invention.
    Each of the first and second embodiments is configured such that the three power converters 20A, 20B and 20C are mounted on the outer end surface SO of the rear frame 12R. However, at least one of the power converters 20A, 20B and 20C, with the exception of the set of power converters, can be mounted on the outer end surface SO of the rear frame 12R. This modification provides the same advantageous effects to the same advantageous effects provided by the first embodiment or the second embodiment, because the above difference between this modification and each embodiment is within the scope of the present invention.
    As illustrated in FIGS. 5 to 7, each of the first and second embodiments is configured so that the semiconductor module 203 comprises at least one of the semiconductor modules M1, M2 and M3, but can include any combination of semiconductor modules Ml, M2 and M3. For example, the semiconductor module 203 may comprise the combination of three semiconductor modules M1 if the rotating electrical machine is a three-phase rotating electrical machine, or the semiconductor module 203 may comprise the combination of three semiconductor modules M2 and three M3 semiconductor modules. Each of the semiconductor modules M1, M2 and M3 may comprise electronic elements, such as coils, capacitors, resistors, and the like. This modification provides the same advantageous effects to the same advantageous effects provided by the first embodiment or the second embodiment, because the above difference between this modification and each embodiment is within the scope of the present invention.
    As illustrated in FIGS. 9 to 12, 14 and 15, each of the first and second embodiments is configured so that the cooling device 202 is mounted, at its second surface S3b, on the first surface S2a of the semi module. -conductor 203 (molded housing 203a) through the insulating adhesive 206. That is to say that the second surface S3b of the cooling device 202 is indirectly in contact with the first surface S2a of the semiconductor module 203. However, the second surface S3b of the cooling device 202 can be directly in contact with the first surface S2a of the semiconductor module 203. In this modification, the internal connecting lines 203c are preferably unexposed from the molded housing 203a. This modification provides the same advantageous effects to the same advantageous effects provided by the first embodiment or the second embodiment, because the above difference between this modification and each embodiment is within the scope of the present invention.
    As illustrated in Fig. 3, each of the first and second embodiments is configured such that the power converter 20 includes the air-cooling device 202 having the plurality of fins 202a, but the power converter may comprise a device fluid cooling. The fluid cooling device includes a coolant inlet, coolant channels, and a coolant outlet. As a coolant, cooling water or cooling oil may be used. The coolant is circulated between the fluid cooler and, for example, a pump. The cooling water is used to cool the semiconductor module 203. This modification provides the same advantageous effects to the same advantageous effects provided by the first embodiment or the second embodiment, because the difference above between this modification and each embodiment is within the scope of the present invention.
    As illustrated in FIG. 1, each of the first and second embodiments is configured so that the rotating electrical machine 10 is designed as an internal rotor rotating electrical machine, but the rotating electrical machine 10 can be designed as a machine. rotating electric rotor with external rotor. The rotor 21 may comprise an integral rotor core in place of the rotor cores 21a and 21c arranged to face each other.
    The rotating electrical machine 10 may comprise a magnetic field element for generating N and S poles which are arranged alternately in the circumferential direction of the rotor 21. This modification eliminates the need to install the brush holder 16 and the slip rings 18 in the rotating electrical machine, because the need to feed the rotor coil 21b is eliminated.
    The frame 12 may be composed of an integrated frame made by integrating the front frame 12F with the rear frame 12R. Frame 12 may also include, formed therein, a coolant inlet, coolant channels, and a coolant outlet, such as the fluid cooler. Cooling of the rotating electrical machine 20 using the cooling fluid and cooling of the rotating electrical machine 20 using the air cooling device 22 improves the cooling efficiency of the rotating electrical machine 20.
    As illustrated in FIG. 1, in each of the first and second embodiments, each of the stator core 14b and the rotor cores 21a and 21b is configured as a stack of steel sheets consisting of a plurality of metal plates. magnetic steel stacked on top of each other. In addition, each of the rotor cores 21a and 21c includes a plurality of claw poles. However, the present invention is not limited to these configurations.
    Specifically, at least one of the stator core 14b and rotor cores 21a and 21b may be made of a single magnetic material, or may further be composed of at least one permanent magnet, or may be composed of combination of a magnetic material and a permanent magnet. If at least one of the stator core 14b and rotor cores 21a and 21b comprises at least one permanent magnet, a reluctance torque based on the magnetic flux flowing through the poles and a magnetic torque based on the at least one permanent magnet improves the torque performance of the rotating electrical machine 10. If permanent magnets are used in place of the claw poles, it is possible to reduce the number of revolutions of the rotor coil 21b or to eliminate the coil of rotor 21b. The reduction in the number of revolutions of the rotor coil 21b or the elimination of the rotor coil 21b makes it possible to reduce the size of the rotating electrical machine 10. These modifications provide the same advantageous effects to the identical advantageous effects provided by the first mode or the second embodiment, because the above difference between these modifications and each embodiment is within the scope of the present invention.
    As illustrated in FIG. 1, in each of the first and second embodiments, the rotor 21 and the cooling fans 13 are mounted separately on the frame 12, but they can be integrated with each other, and the integrated assembly of the rotor 21 and the cooling fans 13 can be mounted on the frame 12. This modification provides the same advantageous effects to the same advantageous effects provided by the first embodiment or the second embodiment, because the above difference between this modification and each embodiment is within the scope of the present invention.
    Although the illustrative embodiments of the present invention have been described herein, the present invention is not limited to the embodiment described herein, but includes any and all embodiments including modifications, omissions combinations (e.g., aspects among various embodiments), adaptations and / or variations as appreciated by those skilled in the art based on the present invention. The limitations in the claims should be construed in a broad sense based on the language used in the claims and not be limited to the examples described in this specification or during the continuation of the application, which examples should be construed as non-exclusive.
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    A power converter (20, 20A, 20B, 20C) for performing power conversion between an external DC power source (E) and a stator coil (14a) of a rotating electrical machine (10), the converter power unit comprising: a housing (204) having opposing first and second (SLa, SI b) surfaces; a semiconductor module (203) comprising at least one semiconductor element (Q1, Q2, D1, D2) and having a predetermined surface (S2a), the semiconductor module being arranged in the housing so as to cope with the first surface of the housing, and being configured to perform the power conversion; a cooling device (202) arranged to be directly or indirectly in surface contact with the predetermined surface (S2a) of the semiconductor module; a plurality of external connection lines (203d) emerging from the semiconductor module and folded to be separated from the cooling device, each of the outer wires having a terminal end (T2), the terminal end of each of the connection lines external projections projecting from a virtual plane extending along the second surface of the housing; a plurality of connection wires (204a) each comprising: an inner portion disposed in the housing; and an outer portion emerging from the housing and folded to be separated from the cooling device, the outer portion of each of the connection wires having a terminal end (T1), the terminal end of the outer portion of each of the connection wires protruding from the virtual plane; a joining portion (207) at which the terminal end (T2) of each of the outer wires is joined to the terminal end (T1) of the outer portion of the corresponding one of the connecting wires; a cover member (208) extending from the second surface (Slb) of the housing to the cooling device so as to cover the external connection lines, the outer portions of the connection wires and the joint portion; and a resin filler (209) introduced into a space defined between the housing, the cooling device and the cover member.
    [2" id="c-fr-0002]
    The power converter of claim 1, wherein the semiconductor module comprises a resin molded housing wherein said at least one semiconductor element is molded.
    [3" id="c-fr-0003]
    The power converter of claim 1 or 2, wherein the semiconductor module further comprises: a cooled portion which is cooled by the cooling device through the predetermined surface of the semiconductor module; and an inner connecting line disposed in the cooled portion and having a greater thickness than each of the external connecting lines.
    [4" id="c-fr-0004]
    A power converter according to any one of claims 1 to 3, wherein said at least one semiconductor element comprises at least a pair of first and second semiconductor elements connected in series with each other, the first semiconductor element of said at least one pair being an upper branch switching element connected to a positive terminal of the DC power source, the second semiconductor element of said at least one pair being a switching element of lower branch connected to a negative terminal of the DC power source.
    [5" id="c-fr-0005]
    The power converter of any one of claims 1 to 4, wherein: the semiconductor modules have opposite surfaces different from the predetermined surface; and the external connection lines comprise: a first set of external connection lines emerging from one of the opposite surfaces of the semiconductor module; and a second set of external connection lines emerging from the other opposite surfaces of the semiconductor module.
    [6" id="c-fr-0006]
    The power converter according to any one of claims 1 to 5, further comprising: an insulating element interposed between the predetermined surface of the semiconductor module and the cooling device, the insulating element having a thermal conductivity greater than that of the resin filler.
    [7" id="c-fr-0007]
    The power converter of any of claims 1 to 6, wherein: the cover member has a first end portion joined to the second surface of the housing and a second end portion joined to the cooling device. ; the first end of the cover member has a first joining portion at one end thereof; the second housing surface has a second assembly portion formed therein; and the first assembly portion of the first end of the cover member is inserted into the second assembly portion of the second surface of the housing.
    [8" id="c-fr-0008]
    The power converter of any one of claims 1 to 7, wherein: the cover member serves as a portion of the housing for supporting the semiconductor module.
    [9" id="c-fr-0009]
    9. A rotating electrical machine comprising: a rotor; a stator arranged to face the rotor; a frame that rotates the rotor and supports the stator; and a power converter for performing power conversion between an external DC power source (E) and a stator coil (14a) of the stator, the power converter comprising: a housing (204) having first and second opposing surfaces (Sla, Slb); a semiconductor module (203) comprising at least one semiconductor element (Q1, Q2, D1, D2) and having a predetermined surface (S2a), the semiconductor module being arranged in the housing so as to cope with the first surface of the housing, and being configured to perform the power conversion; a cooling device (202) arranged to be directly or indirectly in surface contact with the predetermined surface (S2a) of the semiconductor module; a plurality of external connection lines (203d) emerging from the semiconductor module and folded to be separated from the cooling device, each of the outer wires having a terminal end (T2), the terminal end of each of the external connection lines being projection of a virtual plane extending along the second surface of the housing; a plurality of connection wires (204a) each comprising: an inner portion disposed in the housing; and an outer portion emerging from the housing and folded to be separated from the cooling device, the outer portion of each of the connection wires having a terminal end (T1), the terminal end of the outer portion of each of the connection wires protruding from the virtual plane; a joining portion (207) at which the terminal end (T2) of each of the outer wires is joined to the terminal end (T1) of the outer portion of the corresponding one of the connecting wires; a cover member (208) extending from the second surface (Slb) of the housing to the cooling device so as to cover the external connection lines, the outer portions of the connection wires and the joint portion; and a resin filler (209) introduced into a space defined between the housing, the cooling device and the cover member.
    [10" id="c-fr-0010]
    The rotary electric machine according to claim 9, wherein the frame has an outer surface on which the housing of the power converter is mounted.
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    同族专利:
    公开号 | 公开日
    DE102016124627A1|2017-06-22|
    JP2017112808A|2017-06-22|
    US10396636B2|2019-08-27|
    CN106898592A|2017-06-27|
    CN106898592B|2021-01-29|
    FR3045977B1|2019-04-05|
    US20170179796A1|2017-06-22|
    JP6485705B2|2019-03-20|
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    法律状态:
    2017-12-21| PLFP| Fee payment|Year of fee payment: 2 |
    2018-08-03| PLSC| Publication of the preliminary search report|Effective date: 20180803 |
    2019-12-19| PLFP| Fee payment|Year of fee payment: 4 |
    2020-12-23| PLFP| Fee payment|Year of fee payment: 5 |
    2021-12-24| PLFP| Fee payment|Year of fee payment: 6 |
    优先权:
    申请号 | 申请日 | 专利标题
    JP2015247935|2015-12-18|
    JP2015247935A|JP6485705B2|2015-12-18|2015-12-18|Power converter and rotating electric machine|
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